SAC305 reflow profile applicable halogen 

free low Ag solder paste

S1XBIG58-M500-4

Sn 1.1Ag 0.7C 1.8Bi + Ni

The only difference from SAC305 is "low cost"

A very small amount of two modifying elements Bi and Ni are added. Different effects from

 these elements achieved strong and easy-to-use low Ag solder that is equivalent to or sup

erior to SAC305, such as the melting point, thermal resistance, and time-dependent change

 in crystal structures.Click here for the mechanism of hybrid reinforcement.

Maintains thermal-fatigue resistance for a long time

IMCs containing Ni (yellow points in the diagram on the left) finely disperse among Sn

 crystals and prevents growth of Sn crystals due to thermal shocks. Therefore, S1XBIG

/S01XBIG makes a clear distinction from SAC305 also for its "long-lasting robustness" 

not just temporary withstandability.

Reflow profile of SAC305 applicable

The melting point of S1XBIG is 211-223oC. By adding KOKI's newly develo

ped flux into the mix, the temperature profile of SAC305 has become applic

able to S1XBIG. S1XBIG is flexible solder paste which is low in Ag yet has w

orkability as high as conventional products.