SAC305 reflow profile applicable halogen
free low Ag solder paste
Sn 1.1Ag 0.7C 1.8Bi + Ni
The only difference from SAC305 is "low cost"
A very small amount of two modifying elements Bi and Ni are added. Different effects from
these elements achieved strong and easy-to-use low Ag solder that is equivalent to or sup
erior to SAC305, such as the melting point, thermal resistance, and time-dependent change
in crystal structures.Click here for the mechanism of hybrid reinforcement.
Maintains thermal-fatigue resistance for a long time
IMCs containing Ni (yellow points in the diagram on the left) finely disperse among Sn
crystals and prevents growth of Sn crystals due to thermal shocks. Therefore, S1XBIG
/S01XBIG makes a clear distinction from SAC305 also for its "long-lasting robustness"
not just temporary withstandability.
Reflow profile of SAC305 applicable
The melting point of S1XBIG is 211-223oC. By adding KOKI's newly develo
ped flux into the mix, the temperature profile of SAC305 has become applic
able to S1XBIG. S1XBIG is flexible solder paste which is low in Ag yet has w
orkability as high as conventional products.