"Hybrid" high reliability halogen free low Ag solder paste
S01XBIG58-M500-4
Sn 0.1Ag 0.7Cu 1.6Bi + Ni

The only difference from SAC305 is "low cost"
A very small amount of two modifying elements Bi and Ni are added. Different effects from these
elements achieved strong and easy-to-use low Ag solder that is equivalent to or superior to SAC305, such
as the melting point, thermal resistance, and time-dependent change in crystal structures.Click here for the
mechanism of hybrid reinforcement.
Maintains thermal-fatigue resistance for a long time
IMCs containing Ni (yellow points in he diagram on the left) finely disperse among Sn crystals and
prevents growth of Sn crystals due to thermal shocks. Therefore, S1XBIG/S01XBIG makes a clear distinction
from SAC305 also for its "long-lasting robustness" not just temporary withstandability.
Achieved both low-Ag and halogen-free
KOKI strives to respond to customers' requests for cost cutting and to become, as a company
that sets a high value on environmental conservation, a good partner of all customers who are
considerate to the environment. Therefore, all our low Ag products have halogen free versions in
their line-up.